Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods

1. An anisotropic conductive film composition, comprising:

about 1 to about 80% by weight of a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin;

about 1 to about 50% by weight of a second epoxy resin including an acetal epoxy resin;

about 1 to about 50% by weight of an additional polymer resin;

about 0.1 to about 15% by weight of an epoxy resin curing agent; and

about 0.01 to about 20% by weight of conductive particles.

2. The composition as claimed in claim 1 , wherein the acetal epoxy resin is represented by Formula 2 or 3:

wherein:

in Formulae 2 and 3, R and R′ are each independently a hydrogen atom, a C 1 -C 20 alkyl group, an aryl group, or an aralkyl group, and

in Formula 2, each [ ] is independently an alkylene.

3. The composition as claimed in claim 1 , wherein the acetal epoxy resin has a weight average molecular weight of about 100 to about 500,000.

4. The composition as claimed in claim 1 , wherein:

the additional polymer resin includes at least one of an acrylonitrile resin, a styrene-acrylonitrile resin, a butadiene resin, an acrylic resin, a urethane resin, an epoxy resin, a phenoxy resin, a polyamide resin, an olefin resin, and a silicone resin, and

the additional polymer resin has a weight average molecular weight of about 1,000 to about 1,000,000.

5. The composition as claimed in claim 4 , wherein the additional polymer resin has a glass transition temperature of about 100° C. to about 200° C.

6. The composition as claimed in claim 1 , wherein the first epoxy resin includes at least one of a solid epoxy resin, a liquid epoxy resin, and a soluble epoxy resin.

7. The composition as claimed in claim 1 , wherein:

the first epoxy resin includes a fluorene group represented by Formula 1:

in Formula 1, each R is independently alkyl, alkoxy, aryl, or cycloalkyl, each m is independently an integer from 0 to 4, and each n is independently an integer from 2 to 5.

8. The composition as claimed in claim 1 , wherein the epoxy resin curing agent includes at least one of an acid anhydride curing agent, an amine curing agent, an imidazole curing agent, a hydrazide curing agent, and a cationic curing agent.

9. The composition as claimed in claim 1 , wherein the conductive particles include at least one of metal particles, carbon particles, metal-coated resin particles, and conductive particles coated with insulating particles.

10. The composition as claimed in claim 1 , wherein the composition further comprises an additive including at least one of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator, and a coupling agent.

11. The composition as claimed in claim 10 , wherein the composition comprises about 0.01 to about 5% by weight of the additive.

12. An anisotropic conductive film

prepared from the anisotropic conductive film composition as claimed in claim 1 .