Patent Assignment
Reel/Frame 019227/0578
Assignment of Assignor's Interest
Recorded: 2007-04-20
Pages: 2
Assignors
ETO, TAKUYA
Executed: 2007-03-08
IKEMURA, KAZUHIRO
Executed: 2007-03-08
TOYODA, EIJI
Executed: 2007-03-08
NAKABAYASHI, KATSUYUKI
Executed: 2007-03-08
TSUKAHARA, DAISUKE
Executed: 2007-03-08
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA 567-8680, JAPAN
Covered Property
(1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 2, 2023
From: NITTO DENKO CORPORATION
To: RESONAC CORPORATION; NITTO DENKO CORPORATION
Reel/Frame 064463/0170 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
Assignment of Assignor's Interest
Jul 29, 2024
From: NITTO DENKO CORPORATION
To: RESONAC CORPORATION
Reel/Frame 068111/0360 →