IP Library › Assignment 019350/0204
Patent Assignment
Reel/Frame 019350/0204

Assignment of Assignor's Interest

Recorded: 2007-05-29 Pages: 4
Assignors
DOAN, CHINH HUY
Executed: 2007-05-18
ALI, MOHAMMED ERSHAD
Executed: 2007-05-18
Assignee
SIBEAM, INC.
555 N. MATHILDA AVENUE, SUNNYVALE, CALIFORNIA, 94085
Covered Property (1)
Surface Mountable Integrated Circuit Packaging Scheme
Patent: 7,675,465 →
Application: 11/752,083 →
Publication: US 2008/0291115
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Mar 19, 2015
From: LATTICE SEMICONDUCTOR CORPORATION; SIBEAM, INC.; SILICON IMAGE, INC.; DVDO, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 035226/0289 →
Assignment of Assignor's Interest Mar 7, 2017
From: LATTICE SEMICONDUCTOR CORPORATION; SIBEAM, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 041905/0814 →
Release of Security Interest Mar 7, 2017
From: JEFFERIES FINANCE LLC
To: LATTICE SEMICONDUCTOR CORPORATION; SILICON IMAGE, INC.; SIBEAM, INC.; DVDO, INC.
Reel/Frame 041905/0860 →
Release of Security Interest May 21, 2019
From: JEFFERIES FINANCE LLC
To: LATTICE SEMICONDUCTOR CORPORATION; SILICON IMAGE, INC.; SIBEAM, INC.; DVDO, INC.
Reel/Frame 049827/0326 →