Patent Assignment
Reel/Frame 019351/0402
Assignment of Assignor's Interest
Recorded: 2007-05-25
Pages: 4
Assignor
CHEN, WEI-SU
Executed: 2007-05-11
Assignees
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195 CHUNG HSING ROAD, SEC. 4, CHUTUNG, HSINCHU, TAIWAN
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
NANYA TECHNOLOGY CORPORATION
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN, TAOYUAN, R.O.C., TAIWAN
PROMOS TECHNOLOGIES INC.
3F. NO. 19, LI HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
WINBOND ELECTRONICS CORP.
NO. 4, CREATION RD. III, SCIENCE-BASED INDUSTRIAL PRK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Phase Change Memory Device and Method for Fabricating the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2010
From: POWERCHIP SEMICONDUCTOR CORP.; NANYA TECHNOLOGY CORPORATION; PROMOS TECHNOLOGIES INC.; WINBOND ELECTRONICS CORP.
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 024140/0941 →
Assignment of Assignor's Interest
Dec 12, 2011
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HIGGS OPL. CAPITAL LLC
Reel/Frame 027364/0397 →
Confirmatory Assignment
Jan 20, 2012
From: POWERCHIP SEMICONDUCTOR CORP.; NANYA TECHNOLOGY CORPORATION; PROMOS TECHNOLOGIES INC.; WINBOND ELECTRONICS CORP.
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 027567/0901 →
Merger
Dec 26, 2015
From: HIGGS OPL. CAPITAL LLC
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037360/0803 →
Assignment of Assignor's Interest
Aug 21, 2026
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HIGGS OPL. CAPITAL LLC
Reel/Frame 075733/0186 →