IP Library Assignment 019392/0066
Patent Assignment
Reel/Frame 019392/0066

Assignment of Assignor's Interest

Recorded: 2007-06-06 Pages: 2
Assignor
CHAO, CLINTON
Executed: 2007-04-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Low-Cost and Ultra-Fine Integrated Circuit Packaging Technique
Patent: 7,576,435 →
Application: 11/796,297 →
Publication: US 2008/0265399
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →