Patent Assignment
Reel/Frame 019436/0160
Assignment of Assignor's Interest
Recorded: 2007-06-06
Pages: 2
Assignor
WANG, HSIEN-SHOU
Executed: 2007-05-31
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Flip-Chip Package Substrate and a Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.