IP Library Assignment 025166/0876
Patent Assignment
Reel/Frame 025166/0876

Assignment of Assignor's Interest

Recorded: 2010-10-20 Pages: 3
Assignor
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Flip-Chip Package Substrate and a Method for Fabricating the Same
Patent: 7,867,888 →
Application: 11/808,028 →
Publication: US 2008/0029894
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 6, 2007
From: WANG, HSIEN-SHOU
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 019436/0160 →