Patent Assignment
Reel/Frame 019470/0314
Assignment of Assignor's Interest
Recorded: 2007-06-13
Pages: 2
Assignee
MAGNACHIP SEMICONDUCTOR LTD.
1, HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Mems Device Package That Includes Grinding Mems Device Wafer to Expose Array Pads Corresponding to a Cap Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest
Aug 12, 2013
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 030988/0419 →
Assignment of Assignor's Interest
Jan 18, 2019
From: MAGNACHIP SEMICONDUCTOR, LTD
To: ATRIA TECHNOLOGIES INC.
Reel/Frame 048058/0864 →