Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer

1. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:

preparing a MEMS device wafer where a first trench is formed;

preparing a cap wafer where a plurality of bonding bumps and a plurality of array pads are formed, the array pads formed in a region corresponding to the first trench and respectively coupled to the bonding bumps through inner interconnection lines;

bonding the MEMS device wafer and the cap wafer to make the first trench and the array pads correspond to each other;

grinding a rear portion of the MEMS device wafer to form an opening line exposing the array pads; and

dicing the MEMS device wafer and the cap wafer.

2. The method of claim 1 , wherein preparing the MEMS device wafer comprises:

forming an insulation layer over a silicon on insulator substrate;

forming a silicon-based layer over the insulation layer;

forming a first trench in the silicon-based layer;

forming a second trench deeper than the first trench in the silicon-based layer; and

extending bottom portions of the first and second trenches to form a plurality of inner pads corresponding to the respective bonding bumps, a plurality of barrier walls, and a moving part.

3. The method of claim 2 , wherein the second trench is formed to expose the insulation layer.

4. The method of claim 2 , wherein forming the first trench comprises performing a sawing process.

5. The method of claim 2 , wherein forming the first trench comprises performing an etching process.

6. The method of claim 2 , wherein preparing the cap wafer comprises:

forming a plurality of inner pads, a plurality of outer pads, and a plurality of inner interconnection lines over a silicon oxide layer, the inner interconnection lines respectively coupling the inner pads to the outer pads;

forming an insulation layer to cover the inner pads, the outer pads, and the inner interconnection lines;

forming first and second via holes to expose the respective inner and outer pads;

forming a plurality of first and second plugs filling the respective first and second via holes and respectively coupled to the bonding bumps and the array pads;

simultaneously forming the array pads over the respective second plugs and a sealing line between the bonding bumps and the array pads to encompass the bonding bumps; and

forming the bonding bumps over the respective first plugs.

7. The method of claim 6 , wherein the bonding bumps are formed thicker than the array pads.

8. The method of claim 6 , wherein the bonding bumps include one selected from a group consisting of Au, Ni, and Cu.

9. The method of claim 6 , wherein the first trench is formed to a width of about 30 μm to 200 μm.

10. The method of claim 6 , wherein the first trench is formed to a depth of about 100 μm to 400 μm.

11. The method of claim 6 , wherein the bonding bumps have a thickness of about 10 μm to 30 μm and a width of about 10 μm to 100 μm.

12. The method of claim 6 , wherein bonding the MEMS device wafer and the cap wafer together comprises forming a bonding promoter over the MEMS device wafer.

13. The method of claim 12 , wherein the bonding promoter includes one selected from a group consisting of a TiW/Au structure, a Ti/Al structure, a Ti/TiN/Al structure, and a TiN/Al structure.

14. The method of claim 6 , wherein bonding the MEMS device wafer and the cap wafer together comprises bonding the bonding bumps to the respective inner pads of the MEMS device wafer, and the sealing line to the barrier walls.