Patent Assignment
Reel/Frame 019496/0587
Assignment of Assignor's Interest
Recorded: 2007-06-28
Pages: 8
Assignors
FOONG, SALLY
Executed: 2007-06-05
SIM, CHENG KEE
Executed: 2007-05-30
FOONG, YUE HO
Executed: 2007-05-30
LING, TAN KIAH
Executed: 2007-05-30
GADDAMRAJA, SESHASAYEE
Executed: 2007-06-06
Assignee
SPANSION LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CALIFORNIA, 940883453
Covered Property
(1)
A semiconductor device for stacking dies in a multi-die chip packing using film over wire as well as multi-die chip devices that include film over wire
Application:
11/770,239 →
Publication:
US 2009/0001599
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct Inventor's Name Previously Recorded on Reel 019496 Frame 0587. Assignor(S) Hereby Confirms the Correct Inventor's Name.
Jul 26, 2007
From: FOONG, SALLY; LING, TAN KIAH; KEE, CHENG SIM; GADDAMRAJA, SESHASAYEE
To: SPANSION LLC
Reel/Frame 019599/0106 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest
Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035891/0525 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →