IP Library › Assignment 035891/0525
Patent Assignment
Reel/Frame 035891/0525

Assignment of Assignor's Interest

Recorded: 2015-06-11 Pages: 152
Assignor
SPANSION LLC
Executed: 2015-06-01
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CALIFORNIA, 95134
Covered Properties (20)
Memory Storage via an Internal Compression Algorithm
Application: 11/687,479 →
Publication: US 2008/0228998
Memory System with Depletion Gate
Application: 11/694,089 →
Publication: US 2008/0150005
CMOS Compatible Single-Poly Non-Volatile Memory
Application: 11/764,736 →
Publication: US 2008/0310237
A semiconductor device for stacking dies in a multi-die chip packing using film over wire as well as multi-die chip devices that include film over wire
Application: 11/770,239 →
Publication: US 2009/0001599
Device Having a Protective Cap Formed Over an Anti-Reflective Coating Layer and Over an Insulating Material
Application: 11/781,551 →
Publication: US 2007/0262412
Self reference sensing system and method
Application: 11/804,170 →
Publication: US 2008/0285354
Fuel Cell Using Deuterium
Application: 11/829,135 →
Publication: US 2009/0029202
Singulated Bare Die Testing
Application: 11/835,545 →
Publication: US 2008/0233663
Die Stacking in Multi-Die Stacks Using Die Support Mechanisms
Application: 11/842,655 →
Publication: US 2009/0051043
Process of Forming an Electronic Device Including Depositing Layers Within Openings
Application: 11/844,518 →
Publication: US 2009/0050471
Ta-lined tungsten plugs for transistor-local hydrogen gathering
Application: 11/899,575 →
Publication: US 2009/0065842
Process of Forming an Electronic Device Including Depositing a Conductive Layer Over a Seed Layer
Application: 11/935,544 →
Publication: US 2009/0114542
Method of operating a processing chamber used in forming electronic devices
Patent: 9,157,150 →
Application: 11/950,339 →
Publication: US 2009/0142473
Reducing Noise and Disturbance Between Memory Storage Elements Using Angled Wordlines
Application: 11/957,028 →
Publication: US 2009/0154215
Electronic Device Including a Silicon Nitride Layer and a Process of Forming the Same
Application: 11/961,757 →
Publication: US 2009/0159958
Flexible Flash Interface
Application: 11/963,241 →
Publication: US 2009/0164703
High Performance Flash Channel Interface
Patent: 9,152,496 →
Application: 11/963,466 →
Publication: US 2009/0164704
Semiconductor device and method of manufacturing the same
Application: 12/005,870 →
Publication: US 2009/0020885
Electronic Device Having a Doped Region with a Group 13 Atom
Application: 12/022,795 →
Publication: US 2009/0189212
Semiconductor Device with Ono Film on Lateral Surfaces of Groove Portions Formed in Semiconductor Substrate
Application: 12/026,421 →
Publication: US 2008/0217673
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2007
From: COLECCHIA, ROBERTO; SARTORI, GABRIELE
To: SPANSION, LLC.
Reel/Frame 019025/0716 →
Assignment of Assignor's Interest Mar 30, 2007
From: DING, MENG; SUH, YOUSEOK; ZHENG, WEI; CHANG, KUO-TUNG
To: SPANSION LLC
Reel/Frame 019093/0080 →
Assignment of Assignor's Interest May 16, 2007
From: PARK, SOO-YONG; AKAOGI, TAKAO; VAN BUSKIRK, MICHAEL
To: SPANSION LLC.
Reel/Frame 019362/0120 →
Assignment of Assignor's Interest Jun 28, 2007
From: FOONG, SALLY; SIM, CHENG KEE; FOONG, YUE HO; LING, TAN KIAH
To: SPANSION LLC
Reel/Frame 019496/0587 →
Corrective Assignment to Correct the Correct Inventor's Name Previously Recorded on Reel 019496 Frame 0587. Assignor(S) Hereby Confirms the Correct Inventor's Name. Jul 26, 2007
From: FOONG, SALLY; LING, TAN KIAH; KEE, CHENG SIM; GADDAMRAJA, SESHASAYEE
To: SPANSION LLC
Reel/Frame 019599/0106 →
Assignment of Assignor's Interest Aug 3, 2007
From: HOSSAIN, TIM Z.; POSEY, DANIEL E.
To: SPANSION LLC
Reel/Frame 019644/0067 →
Assignment of Assignor's Interest Aug 10, 2007
From: NORBECK, ROBERT; OJEDA, MARK; AQUINO, ED
To: SPANSION LLC
Reel/Frame 019677/0547 →
Assignment of Assignor's Interest Aug 21, 2007
From: WONG, WAI-LOON; KEE, CHENG-SIM; LAI, NGUK-CHIN; TEH, POH-HUAT
To: SPANSION LLC
Reel/Frame 019726/0290 →
Assignment of Assignor's Interest Aug 24, 2007
From: CHIU, ROBERT J.; WANG, CONNIE PIN-CHIN; NGO, MINH VAN; CHAN, SIMON S.
To: SPANSION LLC
Reel/Frame 019743/0338 →
Assignment of Assignor's Interest Sep 6, 2007
From: BUYNOSKI, MATTHEW
To: SPANSION LLC
Reel/Frame 019833/0960 →
Assignment of Assignor's Interest Nov 6, 2007
From: BOYAPATI, SRIRANGA S.; SMITH, FRANK W.; LAM, KIN-SANG
To: SPANSION LLC
Reel/Frame 020073/0550 →
Assignment of Assignor's Interest Dec 4, 2007
From: ALLEN, MICHAEL B.; RAMOS, JESSE C.; GEUEA, JEFFERY P.; NELSON, ALLAN T.
To: SPANSION LLC
Reel/Frame 020197/0365 →
Assignment of Assignor's Interest Dec 14, 2007
From: PARIKH, SUKETU ARUN; GOPAL, VIDYUT; DAVIS, BRAD
To: SPANSION LLC
Reel/Frame 020249/0801 →
Assignment of Assignor's Interest Dec 28, 2007
From: JONES, GWYN R.; RANDOLPH, MARK
To: SPANSION LLC
Reel/Frame 020301/0530 →
Assignment of Assignor's Interest Jan 30, 2008
From: JONES, GWYN ROBERT; RANDOLPH, MARK
To: SPANSION LLC
Reel/Frame 020439/0756 →
Assignment of Assignor's Interest Mar 19, 2008
From: ONODERA, MASANORI
To: SPANSION LLC
Reel/Frame 020707/0905 →
Assignment of Assignor's Interest Mar 24, 2008
From: RACINO, GREGORY; XIONG, FUXIANG
To: SPANSION, LLC.
Reel/Frame 020694/0191 →
Assignment of Assignor's Interest May 23, 2008
From: MARUYAMA, TAKAYUKI; HAYAKAWA, YUKIO; NANSEI, HAROYUKI
To: SPANSION LLC
Reel/Frame 020993/0754 →
Assignment of Assignor's Interest Dec 31, 2008
From: ZHOU, STEVE X; LI, DANIEL D.
To: NANTRONICS SEMICONDUCTOR, INC.
Reel/Frame 022047/0051 →
Corrective Assignment to Correct the Assignee Address: the Word Suirte on the Line of the Street Address Should Should Be Suite. Previously Recorded on Reel 022047 Frame 0051. Assignor(S) Hereby Confirms the Confirming That the Assignee Address, on the Line with the Street Address Changing the Word Suirte to Suite.. Apr 16, 2009
From: ZHOU, STEVE X.; LI, DANIEL D.
To: NANTRONICS SEMICONDUCTOR, INC.
Reel/Frame 022557/0680 →
Security Agreement Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Patent Purchase Agreement Mar 28, 2012
From: NANTRONICS SEMICONDUCTOR, INC.
To: SPANSION LLC
Reel/Frame 027946/0448 →
Assignment of Assignor's Interest Jul 6, 2012
From: HUI, ANGELA T.; OGURA, JUSUKE; WU, YIDER
To: FASL LLC
Reel/Frame 028499/0612 →
Change of Name Jul 6, 2012
From: FASL LLC
To: SPANSION LLC
Reel/Frame 028500/0037 →
Assignment of Assignor's Interest Jun 17, 2014
From: KANADE, RAVINDRA K.; RACINO, GREGORY; WILES, MICHAEL
To: SPANSION LLC
Reel/Frame 033117/0352 →