Semiconductor device and method of manufacturing the same
One embodiment in accordance with the invention can include a semiconductor device that includes a first substrate, a projection portion that has a first semiconductor chip mounted on the first substrate, a second substrate that is provided on the first substrate and is electrically coupled to the first substrate, and a second semiconductor chip that is mounted on the second substrate. An opening portion is formed by the second substrate. The projection portion is arranged in the opening portion.
1 . A semiconductor device comprising:
a first substrate;
a projection portion that has a first semiconductor chip mounted on the first substrate;
a second substrate that is provided on the first substrate and is electrically coupled to the first substrate; and
a second semiconductor chip that is mounted on the second substrate,
wherein the second substrate forms an opening portion; and
the projection portion is arranged in the opening portion.
2 . The semiconductor device as claimed in claim 1 , wherein:
the second substrate has a region on which the second semiconductor chip is mounted; and
the region covers the opening portion.
3 . The semiconductor device as claimed in claim 1 , wherein:
the second semiconductor chip has an electrode to be coupled to the second substrate; and
the electrode is arranged on the second substrate.
4 . The semiconductor device as claimed in claim 1 further comprising a fixing portion that affixes an upper face of the projection portion to a bottom face of the second semiconductor chip.
5 . The semiconductor device as claimed in claim 4 , wherein the opening portion comprises the fixing portion.
6 . The semiconductor device as claimed in claim 4 , wherein the fixing portion includes an adhesive agent.
7 . The semiconductor device as claimed in claim 1 , wherein the projection portion has a resin-sealing member.
8 . The semiconductor device as claimed in claim 1 , wherein:
the first semiconductor chip is face-down mounted on the first substrate; and
the projection portion is the first semiconductor chip.
9 . The semiconductor device as claimed in claim 1 , wherein the first semiconductor chip includes a plurality of semiconductor chips.
10 . The semiconductor device as claimed in claim 1 further comprising a terminal coupling that couples the first substrate and the second substrate.
11 . A wireless communications device, comprising:
a processor;
a communications component coupled to the processor;
a transmitter coupled to the processor;
a receiver;
an antenna coupled to the transmitter circuit and the receiver circuit; and
a memory coupled to the processor, the memory comprising:
a first substrate;
a projection portion that has a first semiconductor chip mounted on the first substrate;
a second substrate that is provided on the first substrate and is electrically coupled to the first substrate; and
a second semiconductor chip that is mounted on the second substrate,
wherein the second substrate forms an opening portion; and
the projection portion is arranged in the opening portion.
12 . The wireless communications device of claim 11 , wherein said memory is NAND flash memory.
13 . The wireless communications device of claim 11 , wherein said memory is NOR flash memory.
14 . The wireless communications device of claim 11 , wherein said memory comprises at least one memory cell operable to store more than one bit.
15 . A computing device comprising:
a processor;
an input component coupled to the processor;
an output component coupled to the processor; and
a memory coupled to the processor, the memory comprising:
a first substrate;
a projection portion that has a first semiconductor chip mounted on the first substrate;
a second substrate that is provided on the first substrate and is electrically coupled to the first substrate; and
a second semiconductor chip that is mounted on the second substrate,
wherein the second substrate forms an opening portion; and
the projection portion is arranged in the opening portion.
16 . The computing device of claim 15 , wherein said computing device is a personal computer (PC).
17 . The computing device of claim 15 , wherein said computing device is a personal digital assistant (PDA).
18 . The computing device of claim 15 , wherein said computing device is a gaming system.
19 . The computing device of claim 15 , wherein said memory is NAND flash memory.
20 . The computing device of claim 15 , wherein said memory is NOR flash memory.