Patent Assignment
Reel/Frame 020073/0550
Assignment of Assignor's Interest
Recorded: 2007-11-06
Pages: 5
Assignors
BOYAPATI, SRIRANGA S.
Executed: 2007-10-24
SMITH, FRANK W.
Executed: 2007-10-24
LAM, KIN-SANG
Executed: 2007-10-24
Assignee
SPANSION LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Process of Forming an Electronic Device Including Depositing a Conductive Layer Over a Seed Layer
Application:
11/935,544 →
Publication:
US 2009/0114542
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Assignment of Assignor's Interest
Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035891/0525 →