Patent Assignment
Reel/Frame 019544/0924
Assignment of Assignor's Interest
Recorded: 2007-07-11
Pages: 5
Assignors
VRTIS, JOAN K
Executed: 2007-05-31
CURTIS, ANTHONY
Executed: 2007-05-31
TRIMMER, BRET
Executed: 2007-05-23
KING, BRIAN
Executed: 2007-06-27
LU, YUAN Y
Executed: 2007-06-12
BALKAN, HALUK
Executed: 2007-06-18
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 EAST UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Semiconductor Device Package with Bump Overlying a Polymer Layer
Application:
11/718,192 →
Publication:
US 2009/0014869
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.