IP Library › Assignment 019568/0742
Patent Assignment
Reel/Frame 019568/0742

Assignment of Assignor's Interest

Recorded: 2007-07-17 Pages: 3
Assignors
CHANG, KUO-CHIN
Executed: 2007-05-24
PU, HAN-PING
Executed: 2007-05-24
TSAO, PEI-HAW
Executed: 2007-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Enhanced Copper Posts for Wafer Level Chip Scale Packaging
Patent: 7,820,543 →
Application: 11/807,522 →
Publication: US 2008/0296764
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →