Enhanced copper posts for wafer level chip scale packaging
View Patent ↗An enhanced wafer level chip scale packaging (WLCSP) copper electrode post is described having one or more pins that protrude from the top of the electrode post. When the solder ball is soldered onto the post, the pins are encapsulated within the solder material. The pins not only add shear strength to the soldered joint between the solder ball and the electrode post but also create a more reliable electrical connection due to the increased surface area between the electrode post/pin combination and the solder ball. Moreover, creating an irregularly shaped solder joint retards the propagation of cracks that may form in the intermetal compounds (IMC) layer formed at the solder joint.
1. A method for manufacturing a semiconductor device comprising:
creating a wiring layer in a semiconductor die;
depositing a layer of polymer insulator on a first surface of said semiconductor die;
forming one or more electrodes through said layer of polymer insulator, wherein said one or more electrodes are electrically connected to said wiring layer and extend no further than a top of the polymer insulator;
forming at least one pin protruding from a top surface of said one or more electrodes; and
soldering a solder ball to a top surface of each of said one or more electrodes, said solder ball encapsulating said at least one pin.
2. The method of claim 1 further comprising:
removing portions of said layer of polymer insulator such that said top surface of said one or more electrodes protrudes from upper surface of said layer of polymer insulator.
3. The method of claim 1 further comprising:
depositing a conductive layer onto said semiconductor die in electrical contact with said wiring layer, wherein said conductive layer provides said electrical connection between said one or more electrodes and said wiring layer.
4. The method of claim 1 wherein said layer of polymer insulator is selected according to a coefficient of thermal expansion (CTE) property.
5. A method of manufacturing a semiconductor device, comprising:
forming two or more conductive posts on a semiconductor wafer, wherein a first conductive post of the two or more conductive posts is electrically connected to a wiring layer of said semiconductor wafer and is electrically isolated from a second conductive post of the two or more conductive posts on the semiconductor wafer;
forming one or more conductive pins on a surface of the first conductive post, wherein said one or more conductive pins protrude from said surface; and
welding a solder ball onto said surface of the first conductive post after the first conductive post is electrically isolated from the second conductive post, wherein said solder ball encapsulates said one or more conductive pins protruding from said surface.
6. The method of claim 5 further comprising:
depositing a polymer insulation layer onto a wafer surface, wherein the first conductive post is formed within said polymer insulation layer.
7. The method of claim 6 wherein said surface of the first conductive post is one of:
flush with a top surface of said polymer insulation layer; and
protruding from said top surface.
8. The method of claim 6 wherein said polymer insulation layer is made from a material selected from the group consisting essentially of
epoxy; and
polymide.
9. The method of claim 5 further comprising:
depositing a re-distributed layer (RDL) in electrical contact with said wiring layer, wherein the first conductive post is formed in electrical contact with said RDL.
10. The method of claim 5 wherein said forming one or more conductive pins comprises one of:
depositing a material onto said surface;
removing portions of said material on said surface; and
patterning said surface.