IP Library Assignment 019620/0952
Patent Assignment
Reel/Frame 019620/0952

Assignment of Assignor's Interest

Recorded: 2007-07-30 Pages: 4
Assignors
DAUBENSPECK, TIMOTHY HARRISON
Executed: 2007-07-09
GAMBINO, JEFFREY PETER
Executed: 2007-07-23
MUZZY, CHRISTOPHER DAVID
Executed: 2007-07-09
SAUTER, WOLFGANG
Executed: 2007-07-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Semiconductor Chips with Reduced Stress from Underfill at Edge of Chip
Patent: 7,777,339 →
Application: 11/830,228 →
Publication: US 2009/0032929
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Feb 22, 2017
From: GLOBALFOUNDRIES INC.
To: AURIGA INNOVATIONS, INC.
Reel/Frame 041777/0233 →