Patent Assignment
Reel/Frame 019637/0086
Assignment of Assignor's Interest
Recorded: 2007-08-01
Pages: 4
Assignor
SU, SHIH-FENG
Executed: 2007-07-01
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Method of High Density Plasma Gap-Filling with Minimization of Gas Phase Nucleation