IP Library Assignment 019641/0936
Patent Assignment
Reel/Frame 019641/0936

Assignment of Assignor's Interest

Recorded: 2007-07-13 Pages: 2
Assignors
KIM, HYUN JUN
Executed: 2007-06-26
CHOI, CHANG HWAN
Executed: 2007-06-25
LEE, JONG MYEON
Executed: 2007-06-26
KIM, DONG WOOHN
Executed: 2007-06-25
MOON, WO HA
Executed: 2007-06-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package and Method of Manufacturing the Same
Patent: 8,368,097 →
Application: 11/826,248 →
Publication: US 2008/0142822
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →