Light emitting diode package and method of manufacturing the same

1. An LED package, comprising:

a frame having a concave portion formed in a center thereof;

one or more LED chips mounted on a bottom surface of the concave portion; and

a flat dome lens filled in the concave portion,

wherein a vertical section of the flat dome lens comprises a plurality of arcs formed between a plurality of angle dividing lines that pass through a center point of an imagined circle, the center point thereof being positioned on an underside surface of the flat dome lens that contacts the bottom surface of the concave portion,

each of the arcs has a respective radius that is equal to a distance along a particular one of the angle dividing lines that defines each arc, from the center point of the imagined circle to a point at which the particular angle dividing line intersects with a single straight line indicating a height of the flat dome lens,

each of the arcs is positioned in contact with and under the single straight line indicating the height of the flat dome lens,

a line defining a boundary between each pair of adjacent ones of the arcs is convergent with a corresponding angle dividing line that defines each pair of adjacent arcs, with respect to the center point of the circle,

respective angle dividing lines are divided from one another by a predetermined angle, and

distances between the points at which the straight line indicating the height of the flat dome lens and each of the angle dividing lines meet increase in a circumferential direction.

2. The LED package according to claim 1 , wherein a side of the concave portion has a tapered shape expanding upward.

3. The LED package according to claim 1 , wherein the frame has an upper opening having a circular shape, and a lower circumference of the lens has a shape corresponding to the shape of the upper opening of the frame.

4. The LED package according to claim 1 , wherein the lens is formed of a transparent resin material.