Patent Assignment
Reel/Frame 019645/0010
Assignment of Assignor's Interest
Recorded: 2007-07-20
Pages: 3
Assignors
LEE, SI-HOON
Executed: 2007-07-20
KANG, SA-YOON
Executed: 2007-07-20
CHOI, KYOUNG-SEI
Executed: 2007-07-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip on Flexible Printed Circuit Type Semiconductor Package