Chip on flexible printed circuit type semiconductor package
A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.
1. A flexible semiconductor package comprising:
a stack comprising:
a flexible film substrate;
a semiconductor chip on the flexible substrate;
a metal pad layer positioned to dissipate heat generated from the semiconductor chip; and
an insulating flexible reinforcement film attached to a major surface of the metal pad layer,
wherein the flexible reinforcement film has an outer position in the stack with respect to the flexible film substrate, the semiconductor chip and the metal pad layer.
2. The flexible semiconductor package of claim 1 , wherein a width of the flexible reinforcement film is larger than a width of the metal pad layer.
3. The flexible semiconductor package of claim 2 , wherein a part of the flexible reinforcement film is attached to the metal pad layer, and another part of the flexible reinforcement film extends past a boundary of the metal pad layer and is attached to the flexible film substrate with an adhesive.
4. The flexible semiconductor package of claim 3 , wherein the flexible reinforcement film comprises a polyimide flexible film.
5. The flexible semiconductor package of claim 3 , wherein the flexible reinforcement film consists of a polyimide flexible film.
6. The flexible semiconductor package of claim 3 , wherein the flexible reinforcement film comprises opaque means for reducing light reflection.
7. The flexible semiconductor package of claim 3 , wherein the flexible reinforcement film comprises colored means for reducing light reflection.
8. The flexible semiconductor package of claim 3 , wherein the stack has the following order: the flexible reinforcement film, the metal pad layer, the flexible film substrate and the semiconductor chip.
9. The flexible semiconductor package of claim 8 , wherein an edge of the flexible reinforcement film is vertically aligned with an edge of the metal pad layer.
10. The flexible semiconductor package of claim 9 , wherein the width of the metal pad layer is larger than a width of the semiconductor chip.
11. The flexible semiconductor package of claim 10 , wherein the metal pad layer extends past opposite sides of the semiconductor chip.
12. The flexible semiconductor package of claim 3 , further comprising a first adhesive layer including metal particles disposed between the metal pad layer and the flexible reinforcement film.
13. The flexible semiconductor package of claim 12 , further comprising a second adhesive layer including metal particles disposed between the flexible film substrate and the metal pad layer.
14. The flexible semiconductor package of claim 3 , wherein a shape of the metal pad layer is substantially a rectangle with at least one rounded corner.
15. The flexible semiconductor package of claim 1 , wherein the stack has the following order: the flexible film substrate, the semiconductor chip, the metal pad layer and the flexible reinforcement film.
16. The flexible semiconductor package of claim 15 , wherein the metal pad layer extends across and past opposite edges of the semiconductor chip and includes portions attached with adhesive to the flexible film substrate at locations outside the opposite edges of the semiconductor chip.
17. The flexible semiconductor package of claim 15 , wherein the metal pad layer includes slots.
18. The flexible semiconductor package of claim 17 , wherein the slots are disposed at corner edges of the semiconductor chip.
19. The flexible semiconductor package of claim 18 , wherein the slots have an “L” shape.
20. A Chip on Flexible Printed Circuit (COF) type semiconductor package comprising:
an insulating flexible film substrate including an upper surface and a lower surface;
a semiconductor chip on the upper surface of the flexible film substrate;
a metal pad attached to the lower surface of the flexible film substrate at a location underneath the semiconductor chip to dissipate heat generated from the semiconductor chip;
a first adhesive layer on the lower surface of the flexible film substrate attaching the metal pad to the lower surface of the flexible film substrate; and
a reinforcement layer on the lower surface of the flexible film substrate,
wherein the metal pad is interposed between the reinforcement layer and the flexible film substrate.
21. The COF type semiconductor package of claim 20 , wherein the reinforcement layer is an insulating flexible film.
22. The COF type semiconductor package of claim 20 , wherein the metal pad is fully covered by the reinforcement layer.
23. The COF type semiconductor package of claim 20 , wherein the reinforcement layer extends along an entire width of the metal pad.
24. The COF type semiconductor package of claim 20 , wherein a shape of the metal pad layer is substantially a rectangle with at least one rounded corner.
25. The COF type semiconductor package of claim 20 , wherein a shape of the metal pad layer is substantially a rectangle with at least one chamfered corner.
26. The COF type semiconductor package of claim 20 , wherein the first adhesive layer comprises metal particles.
27. The COF type semiconductor package of claim 26 , further comprising a second adhesive layer interposed between the metal pad and the reinforcement layer.
28. The COF type semiconductor package of claim 26 , wherein a space is formed between the flexible film substrate and the reinforcement layer.
29. The COF type semiconductor package of claim 26 , wherein the metal pad comprises aluminum.
30. The COF type semiconductor package of claim 29 , wherein the reinforcement layer comprises a polyimide flexible film.
31. A display device comprising:
an insulating flexible film substrate including an upper surface and a lower surface;
a semiconductor chip on the upper surface of the flexible film substrate;
a metal pad attached to the lower surface of the flexible film substrate at a location underneath the semiconductor chip to dissipate heat generated from the semiconductor chip;
a first adhesive layer on the lower surface of the flexible film substrate attaching the metal pad to the lower surface of the flexible film substrate;
a reinforcement layer on the lower surface of the flexible film substrate, wherein the metal pad is interposed between the reinforcement layer and the flexible film substrate; and
a display panel board wherein the flexible film substrate is connected to the display panel board.
32. A flexible semiconductor package comprising:
a flexible film;
a semiconductor chip on an upper surface of the flexible film;
a composite layer comprising a metal layer to dissipate heat generated from the semiconductor chip, a reinforcement layer and an adhesive attaching the metal layer and the reinforcement layer,
wherein the composite layer is disposed on the lower surface of the flexible film,
wherein the metal layer is disposed between the flexible film and the reinforcement layer,
wherein at a side of the composite layer, edges of the metal layer and the reinforcement layer are aligned.
33. The flexible semiconductor package of claim 32 , wherein the composite layer consists essentially of the metal layer, the reinforcement layer and the adhesive attaching the metal layer and the reinforcement layer.
34. The flexible semiconductor package of claim 32 , wherein the reinforcement layer comprises a first part of the reinforcement layer extending along an entire width of the metal layer, a second part extending from the first part of the reinforcement layer and not attached to the metal layer, and a third part extending from the second part and adhering to the flexible film.