IP Library Assignment 019724/0719
Patent Assignment
Reel/Frame 019724/0719

Assignment of Assignor's Interest

Recorded: 2007-08-21 Pages: 2
Assignor
IWAKI, TAKAYUKI
Executed: 2007-07-27
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Method of Forming Insulating Film and Method of Manufacturing Semiconductor Device
Patent: 7,691,758 →
Application: 11/842,534 →
Publication: US 2008/0050930
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0456 →