Patent Assignment
Reel/Frame 019787/0195
To Correct Spelling of Lst Assignee's Name Previously Recorded on Reel/Frame 019586/0673
Recorded: 2007-08-14
Pages: 4
Assignors
JUNG, JU-HWAN
Executed: 2007-07-07
LEE, JAE-HONG
Executed: 2007-07-03
SHIN, HYUNG-CHEOL
Executed: 2007-07-03
KIM, JUN-SOO
Executed: 2007-07-03
HONG, SEUNG-BUM
Executed: 2007-07-07
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN 3-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION
SAN 4-2, BONGCHEON-DONG, GWANAK-GU, SEOUL, REPUBLIC OF, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Probe Having Embossed Resistive Tip and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.