Semiconductor probe having embossed resistive tip and method of fabricating the same
A semiconductor probe having an embossed resistive tip and a method of fabricating the semiconductor probe are provided. The semiconductor probe includes a protrusion portion protruded to a predetermined height on a cantilever in a first direction crossing a length direction of the cantilever, an embossed resistive tip formed on the protrusion portion, and first and second semiconductor electrode regions formed at opposite sides of the embossed resistive tip at the protrusion portion, wherein the cantilever is doped with a first dopant, the first and second semiconductor electrode regions and the embossed resistive tip are doped with a second dopant having a different polarity from the first dopant, and the embossed resistive tip is doped with a concentration lower than the first and second semiconductor electrode regions.
1. A semiconductor probe having a high resolution embossed resistive tip comprising:
a protrusion portion protruded on a cantilever to a predetermined height, wherein a top surface of the protrusion portion is parallel to a surface of the cantilever;
an embossed resistive tip formed on the protrusion portion; and
first and second semiconductor electrode regions formed at opposite sides of the embossed resistive tip at the protrusion portion,
wherein the cantilever is doped with a first dopant, the first and second semiconductor electrode regions and the embossed resistive tip are doped with a second dopant having a different polarity from the first dopant, and the embossed resistive tip is doped with a concentration lower than the first and second semiconductor electrode regions,
wherein the embossed resistive tip is a rectangular column having a width of 100 nm or less, and
wherein the embossed resistive tip is not doped with the first dopant.
2. The semiconductor probe of claim 1 , wherein the embossed resistive tip has a width of 14 to 50 nm.
3. The semiconductor probe of claim 1 , further comprising first spacers formed on opposite sides of the embossed resistive tip in a length direction of the cantilever.
4. The semiconductor probe of claim 3 , wherein the first spacers comprise an insulating material.
5. The semiconductor probe of claim 3 , further comprising second spacers on opposite sides of the embossed resistive tip in a direction perpendicular to the length direction of the cantilever.
6. The semiconductor probe of claim 5 , wherein the second spacers comprise at least one of an insulating material and a metal.
7. The semiconductor probe of claim 1 , further comprising spacers on opposite sides of the embossed resistive tip in a direction perpendicular to the length direction of the cantilever.
8. The semiconductor probe of claim 7 , wherein the spacers comprise at least one of an insulating material and a metal.