Patent Assignment
Reel/Frame 019797/0007
Assignment of Assignor's Interest
Recorded: 2007-08-29
Pages: 3
Assignors
MURAYAMA, KEI
Executed: 2007-08-10
SHIRAISHI, AKINORI
Executed: 2007-08-10
SUNOHARA, MASAHIRO
Executed: 2007-08-10
TAGUCHI, YUICHI
Executed: 2007-08-10
KOIZUMI, NAOYUKI
Executed: 2007-08-10
HIGASHI, MITSUTOSHI
Executed: 2007-08-10
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Device Package, Semiconductor Apparatus, and Methods for Manufacturing the Same