Patent Assignment
Reel/Frame 019801/0852
Assignment of Assignor's Interest
Recorded: 2007-09-10
Pages: 3
Assignor
KIM, JAE MYUN
Executed: 2007-08-30
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Multi-Chip Semiconductor Package Using the Same