Patent Assignment
Reel/Frame 019901/0541
Assignment of Assignor's Interest
Recorded: 2007-09-25
Pages: 3
Assignors
TZENG, YUAN-LIN
Executed: 2006-06-02
KAO, NAI-HAO
Executed: 2006-06-02
LAI, JENG-YUAN
Executed: 2006-06-02
WANG, YU-PO
Executed: 2006-06-02
HSIAO, CHENG-HSU
Executed: 2006-06-02
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG RD., TANTZU, TAICHUNG, ROC, TAIWAN
Covered Property
(1)
Flip-Chip Semiconductor Package and Chip Carrier for Preventing Corner Delamination