Patent Assignment
Reel/Frame 019908/0744
Assignment of Assignor's Interest
Recorded: 2007-10-02
Pages: 4
Assignors
YAMASHITA, TOMOAKI
Executed: 2007-08-29
INOUE, YASUO
Executed: 2007-08-29
MATSUURA, MASAHARU
Executed: 2007-08-29
ITO, TOYOKI
Executed: 2007-08-29
SHIMIZU, AKIRA
Executed: 2007-08-29
INOUE, FUMIO
Executed: 2007-08-29
NAKASO, AKISHI
Executed: 2007-08-29
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Method of Treating the Surface of Copper and Copper
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →