Patent Assignment
Reel/Frame 019927/0686
Assignment of Assignor's Interest
Recorded: 2007-10-06
Pages: 2
Assignor
TANIKAWA, AKIO
Executed: 2007-09-26
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 22202, JAPAN
Covered Property
(1)
Metal Material, and Coating Film and Wiring for Semiconductor Integrated Circuitry Utilizing the Metal Material