Patent Assignment
Reel/Frame 019932/0611
Assignment of Assignor's Interest
Recorded: 2007-10-09
Pages: 3
Assignor
CHUNG, QWAN HO
Executed: 2007-09-21
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Lightweight and Compact Through-Silicon via Stack Package with Excellent Electrical Connections and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.