Patent Assignment
Reel/Frame 029408/0311
Change of Name
Recorded: 2012-12-05
Pages: 48
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2012-03-23
Assignee
SK HYNIX INC.
2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Lightweight and Compact Through-Silicon via Stack Package with Excellent Electrical Connections and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.