Patent Assignment
Reel/Frame 019967/0797
Assignment of Assignor's Interest
Recorded: 2007-10-16
Pages: 4
Assignors
HAN, HYUN JOO
Executed: 2007-07-20
PARK, TAE SANG
Executed: 2007-07-20
JANG, SE YEONG
Executed: 2007-07-20
MOON, YOUNG JUN
Executed: 2007-07-23
KIM, JUNG HYEON
Executed: 2007-08-08
KANG, SUNG WOOK
Executed: 2007-08-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ic Package and Method of Manufacturing the Same