IC package and method of manufacturing the same
An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
1. An IC package comprising:
a printed circuit board;
a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board;
a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package; and
an interposer having a plurality of through-holes, the interposer being joined to the top of the first BGA IC package,
wherein the second solder balls are directly connecting between the first BGA IC package and the second BGA IC package when the second balls are melt and filled in the through-holes.
2. The IC package according to claim 1 , wherein metal, such as gold, copper, or nickel, is applied to inner circumferential surfaces of the through-holes of the interposer.
3. The IC package according to claim 1 , wherein an alloy having the same components as an alloy constituting the second solder balls is applied to inner circumferential surfaces of the through-holes of the interposer.
4. The IC package according to claim 1 , wherein the through-holes have a diameter less than or equal to that of the second solder balls.
5. The IC package according to claim 1 , wherein the first solder balls and the second solder balls have the same diameter.
6. An IC package comprising:
a printed circuit board;
at least two BGA IC packages stacked on each other and each having a plurality of solder balls, the at least two BGA IC packages being stacked on the printed circuit board at the lower most package; and
an interposer disposed between each of the at least two BGA IC packages and having a plurality of through-holes, each interposer being joined to a top surface of one of the at least two BGA IC packages,
wherein the at least one of solder balls is directly connecting between the first BGA IC package and the second BGA IC package when the at least one solder ball is melt and filled in the at least one of the through-holes.
7. The IC package according to claim 6 , wherein when each BGA IC package is joined together via a respective interposer.
8. The IC package according to claim 1 , wherein the second solder balls are contacted with the circuit pattern of the first BGA IC package.
9. The IC package according to claim 6 , wherein the at least one of the solder balls is contacted with the circuit patterns of the at least two BGA IC packages.