Assignment of Assignor's Interest

Recorded: 2007-10-17 Pages: 6

Assignors

YU, CHEEMEN

Executed: 2007-08-16

VERMA, VANI

Executed: 2007-10-16

TAKIAR, HEM

Executed: 2007-08-28

Assignee

SANDISK CORPORATION

601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

Method of Fabricating a Two-Sided Die in a Four-Sided Leadframe Based Package

Patent: 8,058,099 →

Application: 11/770,052 →

Publication: US 2009/0004782

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.