Patent Assignment
Reel/Frame 019985/0261
Assignment of Assignor's Interest
Recorded: 2007-10-15
Pages: 2
Assignor
MIS, J. DANIEL
Executed: 2007-10-09
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Methods of forming solder bumps on exposed metal pads and related structures
Application:
60/561,863 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.