IP Library › Patent Application 60561863
Patent Application Provisional
App. No. 60/561,863 · Confirmation No. 3658

Methods of forming solder bumps on exposed metal pads and related structures

Inventor: J. Daniel Mis
Provisional Application Expired
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 Code Description Pages PDF
2004-04-13 TRNA Transmittal of New Application 2 View
2004-04-13 SPEC Specification 11 View
2004-04-13 CLM Claims 2 View
2004-04-13 DRW Drawings-only black and white line drawings 8 View
2004-04-13 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/561,863
Filed
2004-04-13