Patent Assignment
Reel/Frame 042360/0880
Release of Security Interest in Patents
Recorded: 2017-04-28
Pages: 4
Assignor
BANK OF AMERICA, N.A.
Executed: 2017-04-27
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Properties
(3)
Methods of Forming Solder Bumps on Exposed Metal Pads and Related Structures
PCT:
PCT/US2005/012029 ↗
Methods of Forming Solder Bumps on Exposed Metal Pads
Methods of forming solder bumps on exposed metal pads and related structures
Application:
60/561,863 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 13, 2005
From: MIS, J. DANIEL
To: UNITIVE INTERNATIONAL LIMITED
Reel/Frame 016517/0185 →
Assignment of Assignor's Interest
Oct 15, 2007
From: MIS, J. DANIEL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 019985/0261 →
Assignment of Assignor's Interest
Nov 1, 2007
From: UNITIVE INTERNATIONAL LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 020066/0387 →
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Assignment of Assignor's Interest
Jun 15, 2017
From: AMKOR TECHNOLOGY, INC.
To: SYNAPTICS INCORPORATED
Reel/Frame 042726/0631 →
Assignment of Assignor's Interest
Jun 15, 2017
From: AMKOR TECHNOLOGY, INC.
To: SYNAPTICS INCORPORATED
Reel/Frame 042727/0085 →
Security Interest
Sep 27, 2017
From: SYNAPTICS INCORPORATED
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 044037/0896 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →