Patent Assignment
Reel/Frame 020066/0387
Assignment of Assignor's Interest
Recorded: 2007-11-01
Pages: 2
Assignor
UNITIVE INTERNATIONAL LTD.
Executed: 2007-10-22
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Methods of Forming Solder Bumps on Exposed Metal Pads
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 13, 2005
From: MIS, J. DANIEL
To: UNITIVE INTERNATIONAL LIMITED
Reel/Frame 016517/0185 →
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Release of Security Interest in Patents
Apr 28, 2017
From: BANK OF AMERICA, N.A.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 042360/0880 →
Assignment of Assignor's Interest
Jun 15, 2017
From: AMKOR TECHNOLOGY, INC.
To: SYNAPTICS INCORPORATED
Reel/Frame 042726/0631 →
Security Interest
Sep 27, 2017
From: SYNAPTICS INCORPORATED
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 044037/0896 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →