Patent Assignment
Reel/Frame 016517/0185
Assignment of Assignor's Interest
Recorded: 2005-07-13
Pages: 3
Assignor
MIS, J. DANIEL
Executed: 2005-07-11
Assignee
UNITIVE INTERNATIONAL LIMITED
CARACASBAAIWEG 201, CURACAO, NETHERLANDS ANTILLES
Covered Property
(1)
Methods of Forming Solder Bumps on Exposed Metal Pads
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 1, 2007
From: UNITIVE INTERNATIONAL LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 020066/0387 →
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Release of Security Interest in Patents
Apr 28, 2017
From: BANK OF AMERICA, N.A.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 042360/0880 →
Assignment of Assignor's Interest
Jun 15, 2017
From: AMKOR TECHNOLOGY, INC.
To: SYNAPTICS INCORPORATED
Reel/Frame 042726/0631 →
Security Interest
Sep 27, 2017
From: SYNAPTICS INCORPORATED
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 044037/0896 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →