IP Library › Assignment 020053/0678
Patent Assignment
Reel/Frame 020053/0678

Assignment of Assignor's Interest

Recorded: 2007-11-01 Pages: 3
Assignors
YANG, WEN-KUN
Executed: 2007-10-30
HSU, HSIEN-WEN
Executed: 2007-10-30
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD, HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property (1)
Semiconductor Device Package Having a Back Side Protective Scheme
Patent: 7,687,923 →
Application: 11/933,758 →
Publication: US 2009/0039497
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →