Patent Assignment
Reel/Frame 020122/0061
Assignment of Assignor's Interest
Recorded: 2007-11-16
Pages: 5
Assignors
SHIMAZAKI, YO
Executed: 2007-10-30
SAITO, HIROYUKI
Executed: 2007-11-06
MASUDA, MASACHIKA
Executed: 2007-11-01
MATSUMURA, KENJI
Executed: 2007-11-01
FUKUCHI, MASARU
Executed: 2007-11-01
IKEZAWA, TAKAO
Executed: 2007-11-01
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA KAGACHO 1-CHOME, SHINJUKU-KU, TOKYO, 162-8001, JAPAN
Covered Property
(1)
Circuit Member, Manufacturing Method for Circuit Members, Semiconductor Device, and Surface Lamination Structure for Circuit Member