Patent Assignment
Reel/Frame 020126/0006
Assignment of Assignor's Interest
Recorded: 2007-11-15
Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
HUANG, CHING-CHENG
Executed: 2001-01-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Assignment of Assignor's Interest
Feb 15, 2019
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 048347/0826 →
Assignment of Assignor's Interest
Feb 15, 2019
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 048347/0953 →