Patent Assignment
Reel/Frame 020208/0074
Assignment of Assignor's Interest
Recorded: 2007-12-06
Pages: 6
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Reduction of Air Pockets in Silicon Crystals by Avoiding the Introduction of Nearly-Insoluble Gases into the Melt
Application:
11/939,393 →
Publication:
US 2009/0120353
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Assignment of Assignor's Interest
Jun 23, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033154/0764 →