Patent Assignment
Reel/Frame 033154/0764
Assignment of Assignor's Interest
Recorded: 2014-06-23
Pages: 6
Assignor
MEMC ELECTRONIC MATERIALS, INC.
Executed: 2014-06-20
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Properties
(4)
Wafer Platform
Application:
11/767,198 →
Publication:
US 2008/0041798
Reduction of Air Pockets in Silicon Crystals by Avoiding the Introduction of Nearly-Insoluble Gases into the Melt
Application:
11/939,393 →
Publication:
US 2009/0120353
Susceptor with Support Bosses
Application:
11/965,459 →
Publication:
US 2009/0165721
Semiconductor And Solar Wafers And Method For Processing Same
Application:
12/847,007 →
Publication:
US 2012/0028439
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →