IP Library Assignment 020225/0612
Patent Assignment
Reel/Frame 020225/0612

Assignment of Assignor's Interest

Recorded: 2007-12-11 Pages: 4
Assignors
KIM, JONG HOON
Executed: 2007-11-30
SUH, MIN SUK
Executed: 2007-11-30
KIM, SEONG CHEOL
Executed: 2007-11-30
YANG, SEUNG TAEK
Executed: 2007-11-30
LEE, SEUNG HYUN
Executed: 2007-11-30
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package Module
Patent: 8,395,245 →
Application: 11/953,967 →
Publication: US 2009/0121326
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
Assignment of Assignor's Interest May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
Corrective Assignment to Correct the Assignee Is Hynix Semiconductor Inc. Not Hynix-Semiconductor Inc. There Is No Hyphen in the Name. Previously Recorded on Reel 67328 Frame 814. Assignor(S) Hereby Confirms the Change of Name. May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →