Patent Assignment
Reel/Frame 020247/0605
Assignment of Assignor's Interest
Recorded: 2007-12-05
Pages: 3
Assignors
LEE, BYOUNG HWA
Executed: 2007-11-12
WI, SUNG KWON
Executed: 2007-11-12
CHUNG, HAE SUK
Executed: 2007-11-12
PARK, DONG SEOK
Executed: 2007-11-12
PARK, SANG SOO
Executed: 2007-11-12
PARK, MIN CHEOL
Executed: 2007-11-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, REPUBLIC OF, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor