Multilayer chip capacitor
A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
1. A multilayer chip capacitor comprising:
a capacitor body formed by laminating a plurality of dielectric layers and having first and second side surface facing each other, a top surface and a bottom surface, the bottom surface being mounted on a circuit board;
a plurality of first and second internal electrodes alternately disposed in the capacitor body with each of the dielectric layers interposed therebetween;
a first external electrode of a first polarity formed on the first side surface to cover upper and lower edges of the first side surface and to partially extend to the top and bottom surfaces;
a second external electrode of the first polarity formed on the second side surface to cover upper and lower edges of the second side surface and to partially extend to the top and bottom surfaces; and
a third external electrode of a second polarity formed on the bottom surface between the first and second external electrodes,
wherein the first and second internal electrodes are disposed in perpendicular to the bottom surface of the capacitor body,
wherein each of the first internal electrodes has a first lead drawn to the first side surface and the bottom surface and a second lead drawn to the second side surface and the bottom surface, and each of the second internal electrodes has a third lead drawn to the bottom surface between the first and second leads,
wherein the first lead is in contact with and fixed to the first external electrode formed on the first side surface and at least one of the top and bottom surfaces, and the second lead is in contact with and fixed to the second external electrode formed on the second side surface and at least one of the top and bottom surfaces, and
wherein the first to third leads are in contact with the first to third external electrodes through the entire length of the edge portions of the respective leads exposed to outer surfaces of the capacitor body to be connected to the first to third external electrodes, respectively,
wherein a lamination direction length of the capacitor body is smaller than a distance between the first side surface and the second side surface,
wherein a width of a portion of the first lead drawn to at least one of the top and bottom surfaces of the capacitor body is equal to a width of a portion of the second lead drawn to at least one of the top and bottom surfaces of the capacitor body, and
wherein a width ratio of a width of the third lead to the width of the portion of the first lead drawn to the at least one of the top and bottom surfaces is 1.38 or more.
2. The multilayer chip capacitor of claim 1 , wherein a width of a portion of the first lead drawn to at least one of the top and bottom surfaces of the capacitor body is equal to a width of a portion of the second lead drawn to at least one of the top and bottom surfaces of the capacitor body.
3. The multilayer chip capacitor of claim 2 , wherein a width of the third lead is larger than the width of the portion of the first lead drawn to the bottom surface.
4. The multilayer chip capacitor of claim 1 , wherein the width ratio ranges from 1.38 to 7.
5. The multilayer chip capacitor of claim 1 , further comprising a fourth external electrode of the second polarity formed on the top surface of the capacitor body between the first external electrode and second external electrode,
wherein each of the second internal electrodes further includes a fourth lead formed between the first and second leads to be drawn to the top surface and to be connected to the fourth external electrode, and
wherein the fourth lead is in contact with the fourth external electrode through the entire edge portion of the fourth lead exposed to the bottom surface to be connected to the fourth external electrode.
6. The multilayer chip capacitor of claim 5 , wherein internal and external structures of the multilayer chip capacitor have up-down symmetry.
7. A multilayer chip capacitor comprising:
a capacitor body formed by laminating a plurality of dielectric layers and having first and second side surface facing each other, a top surface and a bottom surface, the bottom surface being mounted on a circuit board;
a plurality of first and second internal electrodes alternately disposed in the capacitor body with each of the dielectric layers interposed therebetween;
a first external electrode of a first polarity formed on the first side surface to cover upper and lower edges of the first side surface and to partially extend to the top and bottom surfaces;
a second external electrode of the first polarity formed on the second side surface to cover upper and lower edges of the second side surface and to partially extend to the top and bottom surfaces; and
a third external electrode of a second polarity formed on the bottom surface between the first and second external electrodes,
wherein the first and second internal electrodes are disposed in perpendicular to the bottom surface of the capacitor body,
wherein each of the first internal electrodes has a first lead drawn to the first side surface and the bottom surface and a second lead drawn to the second side surface and the bottom surface, and each of the second internal electrodes has a third lead drawn to the bottom surface between the first and second leads,
wherein the first lead is in contact with and fixed to the first external electrode formed on the first side surface and at least one of the top and bottom surfaces, and the second lead is in contact with and fixed to the second external electrode formed on the second side surface and at least one of the top and bottom surfaces, and
wherein the first to third leads are in contact with the first to third external electrodes through the entire length of the edge portions of the respective leads exposed to outer surfaces of the capacitor body to be connected to the first to third external electrodes, respectively,
wherein a lamination direction length of the capacitor body is larger than a distance between the first side surface and the second side surface,
wherein a width of a portion of the first lead drawn to at least one of the top and bottom surfaces of the capacitor body is equal to a width of a portion of the second lead drawn to at least one of the top and bottom surfaces of the capacitor body, and
wherein a width ratio of a width of the third lead to the width of the portion of the first lead drawn to the at least one of the top and bottom surfaces is 2 or more.
8. The multilayer chip capacitor of claim 7 , wherein the width ratio ranges from 2 to 7.