Patent Assignment
Reel/Frame 020351/0572
Assignment of Assignor's Interest
Recorded: 2007-12-28
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages, Stacked Semiconductor Packages, and Methods of Manufacturing the Semiconductor Packages and the Stacked Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.