IP Library › Assignment 026541/0330
Patent Assignment
Reel/Frame 026541/0330

Assignment of Assignor's Interest

Recorded: 2011-07-05 Pages: 3
Assignor
SHTUB, AVRAHAM
Executed: 2011-03-26
Assignee
TECHNION RESEARCH AND DEVELOPMENT FOUNDATION LTD.
TECHNION CITY, ...., HAIFA, ISRAEL
Covered Property (1)
Semiconductor Packages, Stacked Semiconductor Packages, and Methods of Manufacturing the Semiconductor Packages and the Stacked Semiconductor Packages
Patent: 7,825,468 →
Application: 12/003,544 →
Publication: US 2008/0157394
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 28, 2007
From: KWON, YONG-CHAI; LEE, DONG-HO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 020351/0572 →